LED failure analysis

[Source: LED Engineering's "good products LED" magazine September issue of text / Li Jiwei] LED is often influenced by various environmental factors and stress in production and use, reach the expected life or function, namely the failure phenomenon . These stresses include thermal stress, electrical stress, assembly stress, etc., and failures occur once the LED's capacity is exceeded. In addition, once the sulfur ions in the air invade the silver plating layer or the silver paste of the stent, the silver is quickly vulcanized and chemical corrosion failure occurs. To sum up, the main failure modes of LEDs include chip failure, package failure, thermal overstress failure, electrical overstress failure and corrosion failure.

Failure analysis of LEDs often requires electrical and non-destructive physical testing. Physical and chemical analysis is then required to determine failure modes and mechanisms, and corrective actions are proposed to prevent repeated failure modes and failure mechanisms. . Failure analysis is an emerging development discipline with strong practical significance in improving product quality, technology development, improvement, product repair and arbitration failures. Failure analysis is very important to improve the reliability of LED products. Failure analysis work needs to be introduced in the development, production and use of products.

LED failure analysis technology

In order to prevent the loss of evidence or introduce a new failure mechanism, failure analysis should be carried out according to certain procedures. The general procedures for failure analysis are: 1. failure site data collection; 2. electrical measurement and determination of failure mode; 3. failure location; 4. physical analysis and chemical analysis of the failure site; 5. comprehensive analysis to determine the cause of failure, Corrective Action.

In general, we divide failure analysis techniques into non-destructive analysis and destructive analysis. Non-destructive analysis must be completed before destructive analysis to avoid loss of evidence. Non-destructive analysis generally includes electrical performance testing, optical microscopy, X-RAY fluoroscopy, C-SAM scanning ultrasound microscopy, and the like. Destructive analysis generally includes slicing, scanning electron microscopy and energy spectrum SEM & EDS, focused ion beam FIB, Auger electron spectroscopy AES and the like. The following mainly introduces the commonly used analysis equipment.

>>>Unfinished , please refer to the September issue of Gaogong LED 's " LED Good Products" magazine.

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